ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...
MOUNTAIN VIEW, Calif., April 24, 2023 /PRNewswire/ -- Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. (SNPS) (Nasdaq ...
Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback