In SoC design, a streamlined verification and analysis flow can contribute significantly to the success of a product. With manufacturing yield and time-to-market schedules crucial, it is important to ...
Power integrity has become one the most critical issues as chip designs have transitioned to 130nm and 90nm processing technologies. Decreasing supply voltages, increasing device density and leakage ...
PowerBaum is now offered through ASICLAND's solution SoC model, in which ASICLAND is involved in customers' product development process early on. Supporting power analysis service from the early ...
Between the complexity of advanced node design verification and the competition to be first to the market, system-on-chip (SoC) designers no longer have the luxury of waiting until each sub-block of a ...
Samsung Foundry and Synopsys' optimized flow achieves predictable execution of in-system test, implementation, verification, timing and physical signoff for ASIL D-compliant SoC design Includes ...
Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, ...
RFICs (Radio Frequency Integrated Circuits) for wireless data transmission systems, such as transceivers and RF front-end components, are becoming more complex based on the demands of our connected ...
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