Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Analysis of Scattering Characteristics of Large Array Structures Based on Infinitesimal Dipole Model
Abstract: This article proposes a fast and effective method to analyze the scattering characteristics of large array structures based on the infinitesimal dipole model (IDM). Different from the ...
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